Advanced packaging (VECTOR TEOS 3D, panel-level)
VECTOR TEOS 3D is installed at leading logic and memory fabs, and a panel-level packaging centre opened in Salzburg in May 2026.
What it is
Deposition and process tools for stacking chips, including VECTOR TEOS 3D for thick dielectric gap fill between stacked dies, and wet processing for panel-level packaging, which moves production from round wafers to rectangular panels. The Salzburg centre builds on Semsysco, a company Lam bought in 2022.
Why it matters to the stock. AI accelerators depend on high-bandwidth memory and chiplets, so packaging capacity has become a bottleneck. Lam's packaging tools are a smaller business than wafer fab systems, but they add exposure to AI demand beyond the front end.
News
Lam opens Panel-Level Packaging Center of Excellence in Salzburg, Austria
Lam opened its Panel-Level Packaging Center of Excellence in Salzburg, which it calls its first panel-focused wet processing R&D site.