Applied Materials and Intel collaborate on transistors, interconnects and advanced packaging for AI chips

Applied Materials and Intel will work together to speed up development of next-generation transistors, interconnects and advanced packaging for AI chips. The work is split between Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon, and includes Foveros-based 3D stacking. The release does not disclose any financial terms, deal value or purchase commitments.

• Announced October 6, 2026
• Sites: EPIC Center (Silicon Valley) and Intel's Hillsboro, Oregon campus
• Scope: transistors, interconnect scaling and Foveros 3D packaging
• No financial terms disclosed