Coherent launches Bondable Diamond thermal management solutions for chip cooling

Coherent introduced a diamond heat-spreader product with a surface finish that lets it bond directly to semiconductor dies. The company says direct bonding cuts thermal interface resistance by up to 99% for dies up to 100 mm square. The launch extends its thermal portfolio for AI and high-power chips, which it says it can produce at scale through its own diamond growth and finishing operations.

• Bondable diamond spreaders bond directly to the die, cutting thermal interface resistance by up to 99%.
• Covers dies up to 100 mm square.
• Compatible with silicon, silicon carbide, gallium nitride and indium phosphide.
• Built on Coherent's in-house diamond growth, surface finishing and coatings.