IBM and Lam Research sign five-year collaboration on sub-1nm logic scaling

IBM and Lam announced a five-year agreement to develop materials and processes for logic chips below 1 nanometre. The work covers new materials, etch and deposition, and High-NA EUV lithography, and it runs at IBM's NY Creates Albany NanoTech Complex using Lam process tools. The companies build on more than a decade of earlier work together on 7nm, nanosheet and EUV process technologies.

• Five-year collaboration announced March 10, 2026
• Scope: new materials, etch and deposition, and High-NA EUV lithography
• Work runs at IBM's NY Creates Albany NanoTech Complex with Lam tools
• Builds on more than a decade of earlier collaboration