SK hynix shows Vera Rubin-linked HBM4 and SOCAMM2 at TSMC OIP and wins TSMC partner award

At the TSMC OIP Conference in Santa Clara on September 23, SK hynix displayed a Nvidia Vera Rubin superchip setup with 12-layer 36GB HBM4 and 96GB SOCAMM2 modules mounted on it. The booth also showed 12-layer 48GB HBM4E, 16-layer 48GB HBM4 and server DRAM and eSSD products. SK hynix won TSMC's Partner of the Year award in the 3DFabric-HBM integration category for a second straight year, for HBM5 validation on CoWoS packaging. The company published its account on September 28.

• Vera Rubin setup: 12-layer 36GB HBM4 with 96GB SOCAMM2
• HBM4E: 12-layer 48GB; HBM4: 16-layer 48GB
• 256GB 3DS RDIMM and PS1101 E3.S, its first QLC eSSD
• TSMC Partner of the Year, second consecutive year