TSMC weighs switching second Kumamoto fab from 6-12nm chips to 3nm

On February 5, 2026 TSMC said it was evaluating a change for the second Kumamoto, Japan fab, which had been planned for 6-12nm chips, to make 3nm chips. CEO C.C. Wei tied the change to strong AI demand when he met Japanese Prime Minister Sanae Takaichi, who said she wanted the plan to go ahead. At that date the switch was still under evaluation, so 3nm at Kumamoto was not yet confirmed.

• Second Kumamoto fab was previously planned for 6-12nm chips
• Switch to 3nm was under evaluation as of February 5, 2026
• Wei cited AI demand; Takaichi said she wanted the plan to proceed
• Government approval for the 3nm plan came on March 31, 2026