Kinex hybrid bonding system
Introduced October 7, 2025 as an integrated die-to-wafer hybrid bonder; customer adoption not disclosed.
What it is
A tool that does all the steps of die-to-wafer hybrid bonding in one system, connecting copper pads directly instead of using solder bumps. It was co-developed with BE Semiconductor Industries (Besi) and targets chiplet-based GPUs, CPUs and HBM packages.
Why it matters to the stock. Advanced packaging systems are part of Semiconductor Systems, per the fiscal 2025 Form 10-K. Kinex is Applied's hybrid-bonding product, and it is the one to watch for customer wins.
News
Besi joins Applied Materials' EPIC Center as innovation partner in an expanded packaging partnership
Applied Materials and BE Semiconductor Industries (Besi) expanded their partnership, and Besi joined Applied's EPIC Center in Silicon Valley as an innovation partner.
Deal